DIC 2.0 Module
Optional Vision Technology Module for all Akrometrix Thermal Warpage systems for the purpose of measuring Strain & CTE.
Digital Image Correlation (DIC) is a non-contact, full-field optical
technique for measuring both in-plane and out-of-plane displacements of an object surface. A high contrast, random speckle pattern is applied to the surface of interest. Two cameras are mounted above the oven, viewing the sample from different angles. The DIC “2.0” upgrade increases camera resolution and improves strain resolution.
Two simultaneous images from both cameras are digitized. Software identifies the same point on the surface from both perspectives, using pattern recognition of the speckles within a small pixel window. Using the principle of stereo triangulation, the spatial position of the pixel window relative to the cameras is determined in 3D space.
The DIC 2.0 Module is designed to:
- Measure in-plane Strain with respect to temperature, at a resolution of 100 µstrain (∆L/L x 10^6)
- Measure in-plane displacement at a resolution 1.0 µm
- Use strain data to calculate material CTE (Coefficient of Thermal Expansion)
The measurement field of view is ~75 x 75 mm, but sample size can be up to 400 x 400 mm.
The DIC 2.0 Module is offered on the following equipment:
DFP2 Module
Optional Vision Technology Module for all Akrometrix Thermal Warpage systems for the purpose of measuring discontinuous surfaces and varying step heights
The DFP2 Module is an add-on module for the AXP 2.0 and PS600S models. The module uses the Digital Fringe Projection 2 technique to measure a field of view up to 240x192mm and down to 45x36mm with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. The DFP2 Module can be quickly installed on top of the AXP 2.0 or PS600S oven with the shadow moiré grating removed. The use of the module is fully integrated with the Akrometrix Studio Software.
The DFP2 Module compliments the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules.
Sub room temperature module
An optional AXP 2.0 Thermal Warpage System module for the purpose of measuring warpage characteristics, down to -55°C. Ideal for automotive, space and military applications.
The Sub Room Temperature Module is used as an optional module with Akrometrix’ patented TherMoiré® technology. The module, when coupled with the TherMoiré® system, enables automated phase-stepping analysis and convective cooling down to -55°C and heating up to reflow temperatures. For example, the Sub Room Temperature Module can duplicate reliability testing as required for JEDEC temperature cycling initiative JESD22-A104-B.
The Sub Room Temperature Module is comprised of a heating/cooling chamber assembly that fits into an existing TherMoiré® oven chamber and a dual stage air cooler. The system accommodates evaluation of a viewing field as large as 200 mm x 200 mm (8 in. x 8 in.) and uses the fully integrated Surface Measurement operating software. The sample enclosure module comes with different sample support nozzle sizes to hold the samples under test. The free standing chiller enclosure houses the temperature controls, heating/cooling devices, over-temperature safety shut-off electronics, fusing and power distribution.
The Sub Room Temperature Module is designed to:
- Cool samples down to sub-room temperatures as low as -55°C.
- Use convective heat transfer to also attain reflow temperatures
- Focus is on reliability style testing as reflow simulation in terms of heating rates and temperature uniformity is not on par with CRE6
The Sub Room Temperature Module is offered on the following equipment:
CRE6 Module
An optional AXP 2.0 Thermal Warpage system module for the mobile packaging customer looking for Lower Volume & Optimized Reflow Emulation
The CRE6 (Convection Reflow Emulation) Module is an add-on module for the TherMoiré® AXP 2.0 system powered by Akrometrix Studio Software. The CRE6 Module addresses the semiconductor industry requirement for maximum resolution surface measurement and effective reflow emulation with optimized top/bottom temperature uniformity, while utilizing convection heating.
The CRE6 Module enhances Akrometrix’s industry-standard shadow moiré measurement technique and offers Z displacement measurement from 2.5 microns down to sub-micron resolution. The CRE6 Module is the fourth add-on module for the expandable TherMoiré® AXP 2.0 platform.
The CRE6 Module is designed to:
- Most accurately emulate production reflow conditions for semiconductor packages
- + 3.0 °C/sec heating rate
- Sample temperature uniformity +/- 2 °C
- 70 mm diameter circular field of view
The CRE6 Module is offered on the following equipment:
