AXP 2.0-DIC Warpage System

The AXP 2.0 Thermal Warpage System with Second Generation Digital Image Correlation Vision Technology (DIC) uses the Digital Imaging Correlation technique to measure a field of view up to 240mm x 192mm and down to 45mm x 36mm, with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules, or any products with a discontinuous surface and varying step heights.

The AXP 2.0-DIC is an expandable modular metrology platform:

  • Powered by Akrometrix Studio Software
  • Up to 240 mm x 192 mm maximum sample size
  • Acquisition of 5.3 million displacement data points in less than 1 second
  • Enhanced temperature uniformity, utilizing both top and bottom IR heaters
  • High resolution measurement of small form factor samples
  • Increased lab productivity with advanced, powered cooling
  • Multiple part testing for increased throughput with our Studio part tracking software

The AXP 2.0-DIC can be used for a variety of laboratory and production floor applications:

  • Failure/defect analysis
  • Quality assurance/quality control
  • High Volume Testing complimented by Part Tracking technology
  • Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
  • Shape matching between attaching interfaces via Interface Analysis Software
  • Material and Design Choices
  • Characterization of Local Features and Step Height 
  • FEA Model Validation

Other Optional Vision Technologies

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