DIC3 Module

Optional Vision Technology Module for all Akrometrix Thermal Warpage systems for the purpose of measuring Strain & CTE.

Digital Image Correlation (DIC) is a non-contact, full-field optical method for measuring in-plane displacement on a speckle-patterned surface. Stereo cameras mounted above the oven capture simultaneous images of the sample. The software identifies matching speckle patterns in each view and, using stereo triangulation, calculates the 3D position. | Learn More

The DIC3 module has four cameras with automated lens control each capturing 18.4 million data points each, allowing precise strain and CTE measurements for a wide range of part sizes.

The DIC 3 Module is designed to:

  • Measure in-plane Strain with respect to temperature, at a resolution of 100 µstrain (∆L/L x 10^6)
  • Measure in-plane displacement at a resolution 0.5 µm
  • Use strain data to calculate material CTE (Coefficient of Thermal Expansion)

The measurement field of view is from 36 x 33 mm to 225 x 205 mm, but sample size can be down to 3 x 3 mm up to 830 x 820 mm.

The DIC3 Module is offered on the following equipment:

And is backwards comparable with the PS600S and AXP 2.0. When paired with When paired with AXP 2.0, AXP3, or PS600T, it can be configured with a module autoloader for additional automation.

Technical Specs

DFP3 Module

Optional Vision Technology Module for all Akrometrix Thermal Warpage systems for the purpose of measuring discontinuous surfaces and varying step heights

Digital Fringe Projection is a complementary vision measurement technique to Shadow Moiré that uses projected fringes rather than grating moiré lines, with the specific benefit of measuring discontinuous surfaces.  This technique is particularly useful for measuring connectors, sockets, BGA balls, and assembled modules. | Learn More

The DFP3 module features a 16MP camera and a projector, expanding the capabilities of AXP and PS600T systems with step-height measurements at high data density, fully integrated with the Akrometrix Studio Software. The tool is integrated with module autoloader and with automated lens control, users can program and switch between applications using the DFP technique and Shadow Moiré at the core of Akrometrix thermal systems through software.

35mm BGA solder ball grid array top view with solder balls 3D height map
DFPTechnique
Technical Specs

The DFP3 Module capabilities:

  • Warpage resolution down to 1.5 microns
  • Sample areas from 0.5 x 0.5mm up to 240 x 192mm.
  • High data density: 10.5 micron data point size
  • Measures warpage across stepped surfaces spanning a Z-height of up to 50 mm
  • Software-controlled module handling and lensing

The DFP3 Module is offered on the following equipment:

The DFP3 Module. The projector and camera are mounted on a retractable gantry on a frame.
35mm BGA solder ball grid array top view with solder balls 3D height map
DFPTechnique
The DFP3 Module. The projector and camera are mounted on a retractable gantry on a frame.

Sub room temperature module

An optional AXP 3 Thermal Warpage System module for the purpose of measuring warpage characteristics, down to -55°C. Ideal for automotive, space and military applications.

The Sub Room Temperature Module is used as an optional module with Akrometrix patented TherMoiré® technology. The module, when coupled with the TherMoiré® system, enables automated phase-stepping analysis and convective cooling down to -55°C and heating up to reflow temperatures. For example, the Sub Room Temperature Module can duplicate reliability testing as required for JEDEC temperature cycling initiative JESD22-A104-B.

The Sub Room Temperature Module is comprised of a heating/cooling chamber assembly that fits into an existing TherMoiré® oven chamber and a dual stage air cooler. The system accommodates evaluation of a viewing field as large as 200 mm x 200 mm (8 in. x 8 in.) and uses the fully integrated Surface Measurement operating software. The sample enclosure module comes with different sample support nozzle sizes to hold the samples under test. The free standing chiller enclosure houses the temperature controls, heating/cooling devices, over-temperature safety shut-off electronics, fusing and power distribution.

The Sub Room Temperature Module is designed to:

  • Cool samples down to sub-room temperatures as low as -55°C.
  • Use convective heat transfer to also attain reflow temperatures
  • Focus is on reliability style testing as reflow simulation in terms of heating rates and temperature uniformity is not on par with CRE6

The Sub Room Temperature Module is offered on the following equipment:

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