Press Releases

Akrometrix Announces New DFP2-LS Room Temperature System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, announces its Digital Fringe Projection End-of-Line Room Temperature system (DFP2-LS). The days of measuring coplanarity with mechanical shim gauges

Akrometrix Announces New AXP 2.0-DFP2 Warpage System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its AXP 2.0 Thermal Warpage System with Second Generation Digital Fringe Projection Vision Technology (AXP-DFP2.) The AXP2.0-DFP2

Akrometrix Announces New TTSM-JS Room Temperature System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries announces its Table Top Shadow Moiré Room Temperature System with JEDEC Tray Autoloader & scanner (TTSM-JS.) The TTSM-JS provides

Akrometrix Announces New AXP 2.0-DIC Warpage System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries announces its AXP 2.0 Thermal Warpage System with Second Generation Digital Image Correlation Vision Technology (AXP 2.0-DIC.) The AXP

Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX ATLANTA, GA ― February 15 2017 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, is pleased to announce that it has been awarded a

Akrometrix Announces Next Generation AXP Shadow Moiré System ATLANTA, GA ― October 3, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its next-generation Shadow Moiré System – the AXP 2.0. Akrometrix has been supplying thermal warpage systems

Akrometrix Announces New Schedule for Technical Presentations ATLANTA, GA ― September 21, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its upcoming schedule for technical presentations: SMTA International 2016 in Rosemont IL (Sept. 25-29, 2016): “Understanding PCB

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology ATLANTA, GA ― May 4, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6)

Akrometrix Announces the Shipment of Its 300th Shadow Moiré System ATLANTA, GA ― April 28, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company has shipped its 300th shadow moiré metrology system to a leading

Akrometrix Announces Automated Die Attach Tilt Metrology ATLANTA, GA ― February 2016 ― Akrometrix LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or

Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module ATLANTA, GA ― March 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology Akrometrix LLC, the leader in elevated temperature surface characterization, has announced the availability of the CONVECTION REFLOW EMULATION (CRE) Module, the next generation add-on module for the TherMoiré AXP powered by Studio Software. The CRE Module addresses the semiconductor industry requirement for