Thermal Warpage Systems
Ideal for the R&D development of NPI’s, replicating the Warpage characteristics of the Reflow Production Process
The TherMoiré® AXP 3 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400mm x 400mm | Learn more
The TherMoiré® AXP 2.0 with Digital Fringe Projection 2 Module (DFP2) measures a field of view up to 240 x 192mm and down to 45 x 36mm with a measurement resolution down to 2.5 microns | Learn more
The TherMoiré® AXP 2.0 with Digital Image Correlation Module (DIC) feaures enhanced temperature uniformity, utilizing both top and bottom IR heaters, as well as increased lab productivity with advanced, powered cooling | Learn more
The TherMoiré® PS600S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm | Learn more
The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm | Learn more