THERMAL WARPAGE TESTING SERVICES
Test Services Application Process
1. Download our Test Services Sample Information Form
2. Complete form according to the sample information
3. Email form to: testingservices@akrometrix.com
Our Technical Overview Document provides a complete look at the kinds of samples we test:
Testing Service Request
If you have any questions, our applications engineering experts will provide you with accurate and timely information for all your Thermal Warpage and Strain Metrology needs.
We test using three, full-field optical techniques for measuring flatness:
Shadow Moiré allows for the measurement of warpage (out of plane displacement) on smooth, continuous surfaces over temperature. Measurements are fast, full-field, and accurate down to sub-micron resolution, depending on application | Learn More
Digital Image Correlation (DIC) is the only technique that can perform in-plane measurements. DIC uses pattern matching of speckle patterns applied to the sample surface to provide x-y strain and CTE data over temperature | Learn More
Digital Fringe Projection (DFP) is capable of measuring discontinuous surfaces with high data density. The surfaces can have large variations in step heights | Learn More
Our flatness characterization and analysis solutions provide sub 2-second data acquisition during dynamic temperature profiling. Profiles can be customized to match heating rates found in production ovens.
Standard pricing includes 6 discreet measurement points along a profile of your choice.
We encourage clients and prospects to visit our Atlanta, Georgia testing facility to participate in the testing process and review the results in person.
Working with our applications experts directly can enable better understanding of the data and illuminate what’s possible with our technology.