Uncategorized

Akrometrix Announces the Next Generation Digital Fringe Projection Metrology Tool, the DFP3 Module ATLANTA, GA ― December 11, 2026 ― Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for the semiconductor and electronics industries, recently announced the next generation in digital fringe projection (DFP) thermal warpage metrology with its DFP3 module.  […]

Akrometrix Announces Next Generation Thermal Strain and CTE Measurement Tool the DIC3 Module ATLANTA, GA ― December 11, 2026 ― Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal strain metrology with its DIC3 module.  The tool significantly improves data