AXP 2.0-DFP2 Warpage System
The AXP 2.0 Thermal Warpage System with Second Generation Digital Fringe Projection Vision Technology (AXP 2.0-DFP2) uses the Digital Fringe Projection 2 technique to measure a field of view up to 240mm x 192mm and down to 45mm x 36mm, with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules, or any products with a discontinuous surface and varying step heights.
The AXP 2.0-DFP2 is an expandable modular metrology platform:
- Powered by Akrometrix Studio Software
- Up to 240 mm x 192 mm maximum sample size
- Acquisition of 5.3 million displacement data points in less than 1 second
- Enhanced temperature uniformity, utilizing both top and bottom IR heaters
- High resolution measurement of small form factor samples
- Increased lab productivity with advanced, powered cooling
- Multiple part testing for increased throughput with our Studio part tracking software
The AXP 2.0-DFP2 can be used for a variety of laboratory and production floor applications:
- Failure/defect analysis
- Quality assurance/quality control
- High Volume Testing complimented by Part Tracking technology
- Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
- Shape matching between attaching interfaces via Interface Analysis Software
- Material and Design Choices
- Characterization of Local Features and Step Height
- FEA Model Validation
Other Optional Vision Technologies
