Ryan Curry

Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX ATLANTA, GA ― February 15 2017 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, is pleased to announce that it has been awarded a […]

Akrometrix Announces Next Generation AXP Shadow Moiré System ATLANTA, GA ― October 3, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its next-generation Shadow Moiré System – the AXP 2.0. Akrometrix has been supplying thermal warpage systems

Akrometrix Announces New Schedule for Technical Presentations ATLANTA, GA ― September 21, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its upcoming schedule for technical presentations: SMTA International 2016 in Rosemont IL (Sept. 25-29, 2016): “Understanding PCB

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology ATLANTA, GA ― May 4, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6)

Akrometrix Announces the Shipment of Its 300th Shadow Moiré System ATLANTA, GA ― April 28, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company has shipped its 300th shadow moiré metrology system to a leading

Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module ATLANTA, GA ― March 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC