Mark Venco

Akrometrix Announces Automated Die Attach Tilt Metrology ATLANTA, GA ― February 2016 ― Akrometrix LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or […]