Akrometrix Announces New AXP 2.0-DIC Warpage System
ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries announces its AXP 2.0 Thermal Warpage System with Second Generation Digital Image Correlation Vision Technology (AXP 2.0-DIC.)
The AXP 2.0-DIC uses the Digital Imaging Correlation technique to measure strain down to 100 microstrain. The AXP 2.0 DIC accommodates products up to 400mm x 400mm, with optional vision technologies. This technique is used to show in-plane surface strains and calculate CTE (coefficient of thermal expansion) of composite materials.
For more information about the AXP 2.0-DIC, download our product brochure and technical specifications.
Akrometrix is the industry leader in real-time metrology at all levels of electronic materials production, components fabrication, and assembly processes. Our systems utilize Shadow Moiré, with the capability to utilize our add-on Digital Fringe Projection and Digital Image Correlation optical metrology technologies.
Our applications engineering experts are happy to provide you with accurate and timely information for all your Thermal Warpage and Strain Metrology needs. For more information about Akrometrix’s warpage metrology systems, email us at equipmentsales@akrometrix.com or visit www.akrometrix.com.