AXP 2.0 Thermal Warpage System
The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the Shadow Moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
The combination of Shadow Moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré® AXP 2.0, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.
The TherMoiré® AXP 2.0 is an expandable modular metrology platform:
- Powered by Akrometrix Studio Software
- Up to 400 mm x 400 mm maximum sample size
- Acquisition of 1.7 million displacement data points in less than 2 seconds
- Enhanced temperature uniformity, utilizing both top and bottom IR heaters
- High resolution measurement of small form factor samples
- XY axis strain and CTE calculation, via DIC
- Increased lab productivity with advanced, powered cooling
- Support for reliability testing from 150°C to -55°C and reflow simulation to 280°C+, via Sub Room Module
- Multiple part testing for increased throughput
The TherMoiré® AXP 2.0 can be used for a variety of laboratory and production floor applications:
- Failure/defect analysis
- Quality assurance/quality control
- High Volume Testing complimented by Part Tracking technology
- Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
- Shape matching between attaching interfaces via Interface Analysis Software
- Material and Design Choices
- Characterization of Local Features and Step Height using DFP2
- FEA Model Validation
The TherMoiré® AXP 2.0 Optional Modules provide advanced measurement, processing and throughput capabilities:
