DIC3 Module
Optional Vision Technology Module for all Akrometrix Thermal Warpage systems for the purpose of measuring Strain & CTE.
Digital Image Correlation (DIC) is a non-contact, full-field optical method for measuring in-plane displacement on a speckle-patterned surface. Stereo cameras mounted above the oven capture simultaneous images of the sample. The software identifies matching speckle patterns in each view and, using stereo triangulation, calculates the 3D position. | Learn More
The DIC3 module has four cameras with automated lens control each capturing 18.4 million data points each, allowing precise strain and CTE measurements for a wide range of part sizes.
The DIC 3 Module is designed to:
- Measure in-plane Strain with respect to temperature, at a resolution of 100 µstrain (∆L/L x 10^6)
- Measure in-plane displacement at a resolution 0.5 µm
- Use strain data to calculate material CTE (Coefficient of Thermal Expansion)
The measurement field of view is from 36 x 33 mm to 225 x 205 mm, but sample size can be down to 3 x 3 mm up to 830 x 820 mm.
The DIC3 Module is offered on the following equipment:
And is backwards comparable with the PS600S and AXP 2.0. When paired with When paired with AXP 2.0, AXP3, or PS600T, it can be configured with a module autoloader for additional automation.
DFP2 Module
Optional Vision Technology Module for all Akrometrix Thermal Warpage systems for the purpose of measuring discontinuous surfaces and varying step heights
The DFP2 Module is an add-on module for the AXP3, AXP 2.0 and PS600S models. The module uses the Digital Fringe Projection technique to measure a field of view up to 240x192mm and down to 45x36mm with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. The DFP2 Module can be quickly installed on top of the system oven with the shadow moiré grating removed. The use of the module is fully integrated with the Akrometrix Studio Software.
The DFP2 Module complements the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules.
Sub room temperature module
An optional AXP 3 Thermal Warpage System module for the purpose of measuring warpage characteristics, down to -55°C. Ideal for automotive, space and military applications.
The Sub Room Temperature Module is used as an optional module with Akrometrix patented TherMoiré® technology. The module, when coupled with the TherMoiré® system, enables automated phase-stepping analysis and convective cooling down to -55°C and heating up to reflow temperatures. For example, the Sub Room Temperature Module can duplicate reliability testing as required for JEDEC temperature cycling initiative JESD22-A104-B.
The Sub Room Temperature Module is comprised of a heating/cooling chamber assembly that fits into an existing TherMoiré® oven chamber and a dual stage air cooler. The system accommodates evaluation of a viewing field as large as 200 mm x 200 mm (8 in. x 8 in.) and uses the fully integrated Surface Measurement operating software. The sample enclosure module comes with different sample support nozzle sizes to hold the samples under test. The free standing chiller enclosure houses the temperature controls, heating/cooling devices, over-temperature safety shut-off electronics, fusing and power distribution.
The Sub Room Temperature Module is designed to:
- Cool samples down to sub-room temperatures as low as -55°C.
- Use convective heat transfer to also attain reflow temperatures
- Focus is on reliability style testing as reflow simulation in terms of heating rates and temperature uniformity is not on par with CRE6
The Sub Room Temperature Module is offered on the following equipment: