Akrometrix Announces the Next Generation Digital Fringe Projection Metrology Tool, the DFP3 Module

ATLANTA, GA ― December 11, 2026 ― Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for the semiconductor and electronics industries, recently announced the next generation in digital fringe projection (DFP) thermal warpage metrology with its DFP3 module.  The tool extends the AXP and PS600 systems with DFP technology to measure warpage on discontinuous surfaces, improving data density, resolution, and automation, delivering fast and accurate warpage measurements under emulated reflow conditions across more applications.

The DFP3 module uses a 16MP camera and a projector to measure warpage across stepped surfaces spanning a Z-height of up to 50 mm on sample areas ranging from 0.5 × 0.5 mm to 240 × 192 mm, delivering z-resolution down to 1.5 microns. The DFP3 is integrated with a module autoloader that eliminates manual module handling. With automated lens control, users can program and switch between applications using the DFP technique and Shadow Moiré at the core of Akrometrix thermal systems through software. DFP3 is backward compatible with existing AXP 2.0 systems.