{"id":2084,"date":"2021-04-14T16:51:12","date_gmt":"2021-04-14T16:51:12","guid":{"rendered":"https:\/\/akrometrix.com\/?page_id=2084"},"modified":"2025-12-10T16:41:23","modified_gmt":"2025-12-10T21:41:23","slug":"interface-analysis","status":"publish","type":"page","link":"https:\/\/akrometrix.com\/staging1\/interface-analysis\/","title":{"rendered":"Interface Analysis"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"2084\" class=\"elementor elementor-2084\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6abdce0 e-flex e-con-boxed e-con e-parent\" data-id=\"6abdce0\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;animation&quot;:&quot;none&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-ae410c5 e-con-full e-flex e-con e-child\" data-id=\"ae410c5\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3c5011f elementor-widget elementor-widget-heading\" data-id=\"3c5011f\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-large\">Interface Analysis<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-beabd45 elementor-hidden-mobile e-con-full e-flex e-con e-child\" data-id=\"beabd45\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-7292b24 elementor-widget elementor-widget-heading\" data-id=\"7292b24\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">An optional Studio software package that calculates the resulting warpage characteristics\u00a0 of two independent mating surfaces.<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-189f2ba e-flex e-con-boxed e-con e-parent\" data-id=\"189f2ba\" data-element_type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3f5d354 elementor-hidden-tablet elementor-hidden-mobile elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"3f5d354\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-1c4a31b e-con-full e-flex e-con e-child\" data-id=\"1c4a31b\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-28698f6 elementor-widget__width-initial elementor-widget-tablet__width-inherit elementor-widget elementor-widget-text-editor\" data-id=\"28698f6\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.<\/p><p>While standard Akrometrix software allowed the analysis of an individual surface, such as a PCB or BGA, Interface Analysis enables 3D, 2D, and statistical review of a complete interface. Users can now visualize and quantify exactly how two surfaces will mate together. By combining this feature with the ability to measure surfaces at each temperature point during reflow, solder joint formation or failure can be predicted much more easily.<\/p><p>Interface Analysis works with data supplied by any TherMoir\u00e9 systems in use throughout the worldwide Electronics supply chain today. Introducing unique features such as Pass\/Warning\/Fail maps, and various gap and surface gauge information, Interface Analysis lets users see what is happening between two dynamic surfaces through the reflow process. Applications include SMT Assembly Planning and Troubleshooting, Failure Analysis, Supplier Qualification and Comparison, Ongoing SPC, Package Design, and FEA Modeling Validation.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ad76db7 elementor-widget__width-initial elementor-widget-tablet__width-inherit elementor-widget elementor-widget-image\" data-id=\"ad76db7\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"735\" height=\"536\" src=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2021\/04\/PCB-to-Component-IA.png\" class=\"attachment-large size-large wp-image-2187\" alt=\"PCB-to-Component-IA.png\" srcset=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2021\/04\/PCB-to-Component-IA.png 735w, https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2021\/04\/PCB-to-Component-IA-300x219.png 300w\" sizes=\"(max-width: 735px) 100vw, 735px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6305a93 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"6305a93\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0344b37 elementor-widget elementor-widget-heading\" data-id=\"0344b37\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><h1><strong>Two Important Application Areas<\/strong><\/h1><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-88ef961 e-con-full e-flex e-con e-child\" data-id=\"88ef961\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-31319d2 elementor-widget__width-initial elementor-widget-tablet__width-inherit elementor-widget elementor-widget-text-editor\" data-id=\"31319d2\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h2><strong>Package-to-PCB Design and Assembly<\/strong><\/h2><ul><li>From <a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/S19_02.pdf\">Head-in-Pillow defect IPC<\/a> technical paper:<\/li><\/ul><p>\u201cOne of the major contributors to the supplier issues is the integrity of the BGA component.\u00a0<strong>The main component integrity issue that contributes to head-in-pillow defects is component warpage during the product manufacturing reflow process.<\/strong> If the component begins to warp during the soldering process, the component spheres will separate from the solder paste and not wet to the bulk solder. Component package design, materials and integrity all contribute to the potential warpage of the part. <strong>Internal verification testing should be completed to understand the potential component warpage prior to the implementation of a new package into the manufacturing process.<\/strong>\u201d<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0afa6f5 elementor-widget__width-initial elementor-widget-tablet__width-inherit elementor-hidden-desktop elementor-hidden-widescreen elementor-hidden-laptop elementor-hidden-tablet_extra elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"0afa6f5\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b4d404d elementor-widget__width-initial elementor-widget-tablet__width-inherit elementor-widget elementor-widget-text-editor\" data-id=\"b4d404d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h2><strong>Package-on-Package Design and Assembly:<\/strong><\/h2><ul><li>Many Technical Papers describe warpage as critical to PoP design<\/li><li>Thinner Devices lead to thinner PoP layers<\/li><li>Warpage of Top and Bottom \u2018Attach\u2019 Surfaces is Critical<\/li><li>Interface Analysis allows \u2018easy\u2019 shape comparison at all temperatures<\/li><li>User can set Limits and \u2018see\u2019 problem areas in PWF Maps<\/li><li>More Layers (such as with PoPi) make warpage more important<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Interface Analysis An optional Studio software package that calculates the resulting warpage characteristics\u00a0 of two independent mating surfaces. Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"disabled","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"class_list":["post-2084","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages\/2084","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/comments?post=2084"}],"version-history":[{"count":27,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages\/2084\/revisions"}],"predecessor-version":[{"id":8753,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages\/2084\/revisions\/8753"}],"wp:attachment":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/media?parent=2084"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}