{"id":125,"date":"2016-02-16T21:58:38","date_gmt":"2016-02-16T21:58:38","guid":{"rendered":"https:\/\/akrometrix.com\/?page_id=125"},"modified":"2025-11-18T23:50:48","modified_gmt":"2025-11-19T04:50:48","slug":"white-papers-editorials-technical-papers","status":"publish","type":"page","link":"https:\/\/akrometrix.com\/staging1\/white-papers-editorials-technical-papers\/","title":{"rendered":"White Papers, Editorials, Videos &#038; Technical Papers"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"125\" class=\"elementor elementor-125\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0f6571d e-con-full e-flex e-con e-parent\" data-id=\"0f6571d\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;animation&quot;:&quot;none&quot;}\">\n\t\t<div class=\"elementor-element elementor-element-1ab83cf e-con-full e-flex e-con e-child\" data-id=\"1ab83cf\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b88ac55 elementor-widget elementor-widget-heading\" data-id=\"b88ac55\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-large\">WHITE PAPERS, Technical Papers &amp; Videos<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-0a12455 e-flex e-con-boxed e-con e-parent\" data-id=\"0a12455\" data-element_type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-6b86afb e-con-full e-flex e-con e-child\" data-id=\"6b86afb\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4001d84 elementor-widget elementor-widget-text-editor\" data-id=\"4001d84\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Akrometrix Videos<\/strong><\/p>\n<ul>\n<li>Visit the&nbsp;<a href=\"https:\/\/www.youtube.com\/@akrometrix6510\" target=\"_blank\">Akrometrix YouTube Channel<\/a>&nbsp;for Videos on Thermal Warpage, Applications, Software and System Maintenance<\/li>\n<\/ul>\n<p><strong>Akrometrix Technical Papers<\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2025\/03\/Paper-2.pdf\" target=\"_blank\" rel=\"noopener\">Alternative Methods in Measuring BGAs for Thermal Warpage<\/a>\n<ul>\n<li>As originally published in IPC APEX 2025 Proceedings (Best of Conference Winner) | Chris Gastaldo, Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2025\/03\/Paper-1.pdf\" target=\"_blank\" rel=\"noopener\">Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs<\/a>\n<ul>\n<li>As originally published in IPC APEX 2024 Proceedings (Best of Conference Winner) | Gary Brist, Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/Selectively-Assembling-High-Value-Components-Based-on-Warpage-in-Order-to-Improve-Reliability-External.pdf\">Selectively Assembling High-Value Components Based on Warpage in Order to Improve Reliability<\/a>\n<ul>\n<li>As originally published in IPC APEX 2023 Proceedings | Neil Hubble, Chance Rabun<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2019\/12\/MoistureEffectsOnWarpage_External.pdf\">High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating<\/a>\n<ul>\n<li>As originally published in SMTAI 2019 Proceedings | Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2019\/07\/THERMAL-SHADOW-MOIR\u00c9-TO-CROSS-SECTION-CORRELATION-STUDY_External.pdf\">Thermal Shadow Moire to Cross-Section Correlation Study<\/a>\n<ul>\n<li>As originally published in SMTAI 2018 Proceedings | Jorge Arellano, Edgardo Alvarez, Steven Perng, Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2018\/10\/Mawer-et-al-2018-SMTAI-Pkg-CTE-and-Warpage-BLR-External.pdf\">Effects of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling<\/a>\n<ul>\n<li>As originally published in SMTAI 2018 Proceedings | Andrew Mawer, Paul Galles, Mollie Benson, Burt Carpenter, Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2018\/10\/Effects-of-Temperature-Uniformity-on-Package-Warpage-External.pdf\">Effects of Temperature Uniformity on Package Warpage<\/a>\n<ul>\n<li>As originally published in IPC APEX 2018 Proceedings | Neil Hubble, Charly Olson<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/DFPvsSM.pdf\">Comparing Shadow Moire and Digital Fringe Projection Warpage Metrology Techniques<\/a>\n<ul>\n<li>As originally published in SMTAI 2017 Proceedings | Neil Hubble, Leon Weaver<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Variables-Affecting-Bare-PCB-Warpage-During-Reflow.pdf\">Variables Affecting Bare PCB Warpage During Reflow<\/a>\n<ul>\n<li>As originally published in PCB West 2017 Proceedings | Neil Hubble, Avery Yeary<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Measuring-Die-Tilt-Using-Shadow-Moir\u00e9-Optical-Measurements-Phase-2.pdf\">Measuring Die Tilt Using Shadow Moir\u00e9 Optical Measurements &#8211; Phase 2<\/a>&nbsp;(*Die Tilt &#8211; Phase 2)\n<ul>\n<li>As originally published in EPTC 2016 Proceedings | Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Measuring-Die-Tilt-Using-Shadow-Moir\u00e9-Optical-Measurements.pdf\">Measuring Die Tilt Using Shadow Moir\u00e9 Optical Measurements<\/a>&nbsp;(*Die Tilt Phase 1)\n<ul>\n<li>As originally published in iMAPS International 2016 Proceedings | Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/UNDERSTANDING-PCB-DESIGN-VARIABLES.pdf\">Understanding PCB Design Variables<\/a>\n<ul>\n<li>As originally published in PCB West 2016 Proceedings | Donald Adams, Todd MacFadden, Rafael Maradiaga, Ryan Curry<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Surface-Mount-Signed-Warpage-Case-Study_ExternalTradeshow.pdf\">Surface Mount Signed Warpage Case Study<\/a>&nbsp;(*Signed Warpage Phase 2)\n<ul>\n<li>As originally published in IPC APEX 2017 Proceedings | Neil Hubble, Kim Hartnett, and Jerry Young<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Improvements-in-Decision-Making-Criteria-for-Thermal-Warpage_ExternalTradeshow.pdf\">Improvements in Decision Making Criteria for Thermal Warpage<\/a>&nbsp;(*Signed Warpage Phase 1)\n<ul>\n<li>As originally published in iMAPS Device Packaging 2016 Proceedings | Neil Hubble<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Implementing-Warpage-Management-A-Five-Step-Process-for-EMS-Providers.pdf\">Implementing Warpage Management &#8211; A Five-Step Process for EMS Providers<\/a>\n<ul>\n<li>As originally published in US Tech, August 2014 | Ken Chiavone<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Ready-to-Start-Measuring-PCB-Reflow-Warpage-complete-8_20_13.pdf\" rel=\"\">Ready to Start Measuring PCB Reflow Warpage<\/a>\n<ul>\n<li>Ken Chiavone, John Davignon<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/S19_02.pdf\" rel=\"\">Advanced Second Level Assembly Analysis Techniques &#8211; Troubleshooting Head-In-Pillow, Opens, and Shorts with Dual Full-Field 3D Surface Warpage Data Sets<\/a>\n<ul>\n<li>As originally published in IPC APEX EXPO 2013 Proceedings | Ken Chiavone<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/iNEMI-PCB-Dynamic-Coplanarity-at-Elevated-Temperatures.pdf\" rel=\"\">PCB Dynamic Coplanarity at Elevated Temperatures<\/a>\n<ul>\n<li>iNEMI SMT Coplanarity Workgroup | John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Comparing-Techniques-10-07.pdf\" rel=\"\">Comparing Techniques for Temperature-Dependent Warpage Measurement<\/a>\n<ul>\n<li>Jiahui Pan, Ryan Curry, Neil Hubble, Dirk Zwemer<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Thinking-Globally-Measuring-Locally.pdf\" rel=\"\">Thinking Globally, Measuring Locally<\/a>\n<ul>\n<li>Patrick Hassell<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Advanced-Warpage-Characterization.pdf\" rel=\"\">Advanced Warpage Characterization: Location and Type of Displacement can be Equally Important as Magnitude<\/a>\n<ul>\n<li>Patrick Hassell<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/BGA-Warpage-Using-Phase-Stepping.pdf\" rel=\"\">Measurement of Thermally Induced Warpage of BGA Packages\/Substrates Using Phase-Stepping Shadow Moir\u00e9<\/a>\n<ul>\n<li>Yinyan Wang, Patrick Hassell<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Measuring-Board-Flatness.pdf\" rel=\"\">Measuring board and component flatness<\/a>\n<ul>\n<li>Patrick B. Hassell, Thomas E. Adams<\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Warpage-Studies-of-HDI-Test-Vehicles.pdf\" rel=\"\">Warpage Studies of HDI Test Vehicles<\/a>\n<ul>\n<li>Gregory J. Petriccione, I. Charles Ume, Ph.D.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a9e7250 e-con-full e-flex e-con e-child\" data-id=\"a9e7250\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-07ee8fd elementor-widget elementor-widget-text-editor\" data-id=\"07ee8fd\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Akrometrix Documents and Best Practices<\/strong><\/p><ul><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/akrometrix-applications-package-on-package.pdf\" rel=\"\">Akrometrix Applications \u2013 Package on Package (PoP)<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Akrometrix_TestingApplications_13-10-24.pdf\" rel=\"\">Akrometrix Testing Applications<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/5-50-7100-0003-RevA-Socket-Testing-Protocol-Summary.pdf\" rel=\"\">Socket Testing Protocol Summary<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/4-50-7100-0002-RevA-PCB-Testing-Protocol.pdf\" rel=\"\">PCB Testing Protocol\/Best Practices<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/3-50-7100-0001-RevA-Die-and-Package-Testing-Protocol.pdf\" rel=\"\">Die and Package Testing Protocol\/Best Practices<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/2-Introduction-to-High-Volume-Testing-with-Part-Tracking-in-Akrometrix-Studio-2011-04-22DM.pdf\" rel=\"\">Introduction to High Volume Testing with Part Tracking\u2122 in Akrometrix Studio 6.0<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/1-Studio-Upgrade_DM04122011.pdf\" rel=\"\">Why Upgrade to Akrometrix Studio?<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/25-Convective-Reflow-Emulation-Module-Testing-Protocol.pdf\">Convective Reflow Emulation Module Testing Protocol<\/a><\/li><\/ul><p><strong>External Technical Papers<\/strong><\/p><ul><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Industry-Trends-US-Tech-Version.pdf\" rel=\"\">Industry Trends (US Tech Version)<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/FEA-Tuning-with-Shadow-Moire-Data.pdf\" rel=\"\">FEA Simulation and In-situ Warpage Monitoring of Laminated Package Molded with Green EMC Using Shadow Moire System<\/a><ul><li>Zhao Baozong, Vivek Pai, Chinnu Brahateeswaran, Hu Guojun, Spencer Chew, Neephing Chin<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Elevated-Temp-BGA-Warpage-Measurements.pdf\" rel=\"\">Elevated Temperature Measurements of Warpage of BGA Packages<\/a><ul><li>David W. Garrett<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Effect-of-PWB-Warpage-on-BGAs-Over-Temperature.pdf\" rel=\"\">Effect of PWB Warpage on BGAs Over Temperature<\/a><ul><li>Kyra Ewer, Jeffrey Seekatz<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Effect-of-Geometry-and-Temperature-Cycle-on-WLCSPs.pdf\" rel=\"\">Effect of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints<\/a><ul><li>Satish C. Chaparala, Brian D. Roggeman, James M. Pitarresi, Bahgat G. Sammakia, John Jackson, Garry Griffin, Tom McHugh<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/DIC_C4_Analysis.pdf\" rel=\"\">Measurement of Deformation and Strain in Flip Chip on BGA (FC-BGA)<\/a><ul><li>L. Kehoe, V. Guenebaut, P.V. Kelly<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/CSP-Board-Level-Reliability.pdf\" rel=\"\">CSP Board Level Reliability &#8211; Results<\/a><ul><li>H.J. Albrecht, G. Petzold, B. Schwarz, H. Teichmann<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Controlling-Bow-and-Twist.pdf\" rel=\"\">Controlling Bow and Twist<\/a><ul><li>Bob Willis<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Component-Flatness-at-Elevated-Temperature-FINAL-Apr-19.pdf\" rel=\"\">Generalizations about Component Flatness at Elevated Temperature<\/a><ul><li>As originally published in Toronto International Conference on Soldering and Reliability 2013<br \/>Bev Christian, Linda Galvis, Rick Shelley and Matthew Anthon<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Circuit-Board-Warpage-During-Reflow-Characterization.pdf\" rel=\"\">Survey of Circuit Board Warpage During Reflow<\/a><ul><li>Michael J. Varnau<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/IPC-brittle-fracture-SilkWengerCoyleGoodbread.pdf\" rel=\"\">Double Reflow-Induced Brittle Interfacial Failures in Pb-free Ball Grid Array Solder Joints<\/a><ul><li>As originally published in IPC APEX EXPO 2013 Proceedings<br \/>Julie Silk, George Wenger, Richard Coyle, Jon Goodbread, Andrew Giamis<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Amkor_joint_PoP_paper_2006.pdf\" rel=\"\">A Study on Package Stacking Process for Package-on-Package (PoP)<\/a><ul><li>Akito Yoshida, Jun Taniguchi, Katsumasa Murata, Morihiro Kada, Yusuke Yamamoto, Yoshinori Takagi, Takeru Notomi, Asako Fujit<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Paul-Wangu-PCB-flatness-pkg-warpage-4panpacific-121103-Reviewed-Final-4Presentation.pdf\" rel=\"\">Paul Wang &#8211; PCB flatness pkg warpage 4panpacific 121103 Reviewed Final 4Presentation<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Paper-Topography-TAPPI.pdf\" rel=\"\">Paper Topography &#8211; TAPPI<\/a><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/New_Package_Board_Materials_Technology.pdf\" rel=\"\">New Package\/Board Materials Technology for Next-Generation Convergent Microsystems<\/a><ul><li>Nitesh Kumbhat, P. Markondeya Raj, Shubhra Bansal, Ravi Doraiswami, S. Bhattacharya and Rao Tummala<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Warpage-MEPTEC-Report-Winter-2013-2014.pdf\" rel=\"\">The Lead-Free \u201cWhac-A-Mole\u201d<\/a><ul><li>Ron Leckie, President, INFRASTRUCTURE Advisors<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/traceability-article-SMT-Jan-2008.pdf\" rel=\"\">Traceability on the Line<\/a><ul><li>Compiled by SMT<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Shadow-Moire-Enters-Production.pdf\" rel=\"\">Shadow Moire Enters Production<\/a><ul><li>Kathleen McCray<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/PaulWangu-PCBflatnesspkg.pdf\" rel=\"\">Correlation of Solder Joint Reliability of \u00b5PGA Socket To Package Flatness and PCB Warpage<\/a><ul><li>Dr. Paul P.E. Wang, Shlomo Novotny, Keith Graveling, Damian Hujic, Dr. Dereje Agonafer and Wonkee Ahn<\/li><\/ul><\/li><li><a href=\"https:\/\/akrometrix.com\/staging1\/wp-content\/uploads\/2016\/02\/Quantitative_classification_of_saw_marks_of_silicon_wafers.pdf\" rel=\"\">Quantitative Classification of Saw Marks of Silicon Wafers<\/a><ul><li>A. Lawerenz, S. Dauwe, F.W. Schulze<\/li><\/ul><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>WHITE PAPERS, Technical Papers &amp; Videos Akrometrix Videos Visit the&nbsp;Akrometrix YouTube Channel&nbsp;for Videos on Thermal Warpage, Applications, Software and System Maintenance Akrometrix Technical Papers Alternative Methods in Measuring BGAs for Thermal Warpage As originally published in IPC APEX 2025 Proceedings (Best of Conference Winner) | Chris Gastaldo, Neil Hubble Innerlayer Copper Balancing to Reduce PCB [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"site-sidebar-layout":"default","site-content-layout":"default","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"class_list":["post-125","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages\/125","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/comments?post=125"}],"version-history":[{"count":12,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages\/125\/revisions"}],"predecessor-version":[{"id":8924,"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/pages\/125\/revisions\/8924"}],"wp:attachment":[{"href":"https:\/\/akrometrix.com\/staging1\/wp-json\/wp\/v2\/media?parent=125"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}