Tancredo Rocha

Akrometrix Studio Version 10.1 Release ATLANTA, GA ― January 14th, 2026 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, announces their new Studio 10.1 update. Akrometrix Studio version 10.1 is now available and introduces: Profile gauges for validating reflow emulation against […]

Akrometrix Announces the Next Generation Digital Fringe Projection Metrology Tool, the DFP3 Module ATLANTA, GA ― December 11, 2026 ― Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for the semiconductor and electronics industries, recently announced the next generation in digital fringe projection (DFP) thermal warpage metrology with its DFP3 module. 

Akrometrix Announces Next Generation Thermal Strain and CTE Measurement Tool the DIC3 Module ATLANTA, GA ― December 11, 2026 ― Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal strain metrology with its DIC3 module.  The tool significantly improves data

Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T ATLANTA, GA ― August 29, 2025 ― Akrometrix, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.  This system greatly improves temperature uniformity and heating rates,