https://akrometrix.com/staging1 equipmentsales@akrometrix.com | +1 404 486 0880 Fri, 06 May 2022 14:29:41 +0000 en-US hourly 1 https://wordpress.org/?v=6.8.3 https://akrometrix.com/staging1/wp-content/uploads/2019/04/site-icon-150x150.png https://akrometrix.com/staging1 32 32 https://akrometrix.com/staging1/akrometrix-wins-2017-npi-award/ Wed, 15 Feb 2017 20:24:24 +0000 https://akrometrix.com/?p=1099 Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX ATLANTA, GA ― February 15 2017 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, is pleased to announce that it has been awarded a […]

The post Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX first appeared on Akrometrix.]]> https://akrometrix.com/staging1/next-generation-axp-system/ Mon, 03 Oct 2016 20:25:40 +0000 https://akrometrix.com/?p=994 Akrometrix Announces Next Generation AXP Shadow Moiré System ATLANTA, GA ― October 3, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its next-generation Shadow Moiré System – the AXP 2.0. Akrometrix has been supplying thermal warpage systems […]

The post Akrometrix Announces Next Generation AXP Shadow Moiré System first appeared on Akrometrix.]]> https://akrometrix.com/staging1/new-schedule-technical-presentations/ https://akrometrix.com/staging1/new-schedule-technical-presentations/#comments Wed, 21 Sep 2016 15:41:24 +0000 https://akrometrix.com/?p=987 Akrometrix Announces New Schedule for Technical Presentations ATLANTA, GA ― September 21, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its upcoming schedule for technical presentations: SMTA International 2016 in Rosemont IL (Sept. 25-29, 2016): “Understanding PCB […]

The post Akrometrix Announces New Schedule for Technical Presentations first appeared on Akrometrix.]]> https://akrometrix.com/staging1/new-schedule-technical-presentations/feed/ 97 https://akrometrix.com/staging1/cre6-convection-reflow-emulation/ https://akrometrix.com/staging1/cre6-convection-reflow-emulation/#comments Wed, 04 May 2016 18:58:51 +0000 https://akrometrix.com/?p=882 Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology ATLANTA, GA ― May 4, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) […]

The post Akrometrix Releases the CRE6, Convection Reflow Emulation Module first appeared on Akrometrix.]]> https://akrometrix.com/staging1/cre6-convection-reflow-emulation/feed/ 85 https://akrometrix.com/staging1/300th-shadow-moire-system/ https://akrometrix.com/staging1/300th-shadow-moire-system/#comments Thu, 28 Apr 2016 18:56:22 +0000 https://akrometrix.com/?p=880 Akrometrix Announces the Shipment of Its 300th Shadow Moiré System ATLANTA, GA ― April 28, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company has shipped its 300th shadow moiré metrology system to a leading […]

The post Akrometrix Announces the Shipment of Its 300th Shadow Moiré System first appeared on Akrometrix.]]> https://akrometrix.com/staging1/300th-shadow-moire-system/feed/ 87 https://akrometrix.com/staging1/enhanced-digital-image-correlation-dic-module/ https://akrometrix.com/staging1/enhanced-digital-image-correlation-dic-module/#comments Wed, 30 Mar 2016 19:56:25 +0000 https://akrometrix.com/?p=688 Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module ATLANTA, GA ― March 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC […]

The post Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module first appeared on Akrometrix.]]> https://akrometrix.com/staging1/enhanced-digital-image-correlation-dic-module/feed/ 75