Akrometrix Announces Next Generation Thermal Warpage Measurement System AXP3 Atlanta, Georgia – Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its AXP3 system. This system expands on the widely used shadow moiré technology by bringing the […]
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New Studio 9.0 Software Release and Updates ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, announces their new Studio 9.0 update.Akrometrix Studio Software 9.0 introduces key bug fixes to the previous 8.6 release, with
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Behind the Scenes Features Akrometrix On TV ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, announces their featured segment on Behind the Scenes with Laurence Fishburne. Behind the Scenes with Laurence Fishburne is an
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New TTDFP2 Room Temperature System ATLANTA, GA ― August 11st, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its Table Top Digital Fringe Projection 2 Room Temperature System (TTDFP2). The TTDFP2 provides fast and accurate surface topography
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Akrometrix Announces New DFP2-LS Room Temperature System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, announces its Digital Fringe Projection End-of-Line Room Temperature system (DFP2-LS). The days of measuring coplanarity with mechanical shim gauges
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Akrometrix Announces New AXP 2.0-DFP2 Warpage System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its AXP 2.0 Thermal Warpage System with Second Generation Digital Fringe Projection Vision Technology (AXP-DFP2.) The AXP2.0-DFP2
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Akrometrix Announces New TTSM-JS Room Temperature System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries announces its Table Top Shadow Moiré Room Temperature System with JEDEC Tray Autoloader & scanner (TTSM-JS.) The TTSM-JS provides
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Akrometrix Announces New AXP 2.0-DIC Warpage System ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries announces its AXP 2.0 Thermal Warpage System with Second Generation Digital Image Correlation Vision Technology (AXP 2.0-DIC.) The AXP
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Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology Akrometrix LLC, the leader in elevated temperature surface characterization, has announced the availability of the CONVECTION REFLOW EMULATION (CRE) Module, the next generation add-on module for the TherMoiré AXP powered by Studio Software. The CRE Module addresses the semiconductor industry requirement for
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