Akrometrix Announces Next Generation Thermal Strain and CTE Measurement Tool the DIC3 Module

ATLANTA, GA ― December 11, 2026 ― Akrometrix, LLC,

the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal strain metrology with its DIC3 module.  The tool significantly improves data density and expands the available field of view, delivering more accurate strain and CTE measurements for a wider range of part sizes under emulated reflow conditions.

This add-on module extends the capabilities of the AXP and PS600 systems with digital image correlation (DIC), the industry standard for strain and CTE measurements. The DIC3 module features four 18.4MP cameras with automated lens control, allowing strain measurements of samples areas from 3x3mm to 225x205mm and delivers 4s down to 0.5 microns in the x–y axis and 100 microstrain. DIC3 is backward compatible with existing AXP 2.0 and PS600S systems. When paired with AXP 2.0, AXP3, or PS600T, it can be configured with a module autoloader for additional automation.