Akrometrix Announces Next Generation Thermal Warpage Measurement System AXP3
Atlanta, Georgia – Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its AXP3 system. This system expands on the widely used shadow moiré technology by bringing the technique resolution down to 500 nanometers.
The new tool offers new levels of automation in lensing, exhaust control, temperature response, and a new touch screen HMI, with foreign language support. The upgraded
exhaust system improves upon cooling technology and gives uniform and faster cooldowns for reflow profile emulation or reliability temperature cycling, capable of
covering temperature ranges from -55°C to 350°C.
The AXP3 is expandable to include Akrometrix modules for Digital Fringe Projection technology, to compliment shadow moiré and cover different sample application needs,
as well as Digital Image Correlation to measure surface strain and calculate composite CTE of materials.
For more information about Akrometrix’s warpage metrology systems, please contact us at equipmentsales@akrometrix.com