Akrometrix Announces New AXP 2.0-DFP2 Warpage System
ATLANTA, GA ― August 11th, 2022 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its AXP 2.0 Thermal Warpage System with Second Generation Digital Fringe Projection Vision Technology (AXP-DFP2.)
The AXP2.0-DFP2 uses the Digital Fringe Projection 2 technique to measure a field of view up to 240mm x 192mm and down to 45mm x 36mm, with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. This technique is particularly useful for the measurement of connectors, sockets, BGA balls, assembled modules, or any products with a discontinuous surface and varying step heights. The AXP 2.0-DFP2 also accommodates substrates up to 400 x 400mm with data acquisition times within 1 second.
For more information about the AXP 2.0-DFP2, download our product brochure and technical specifications.
Akrometrix is the industry leader in real-time metrology at all levels of electronic materials production, components fabrication, and assembly processes. Our systems utilize Shadow Moiré, with the capability to utilize our add-on Digital Fringe Projection and Digital Image Correlation optical metrology technologies.
Our applications engineering experts are happy to provide you with accurate and timely information for all your Thermal Warpage and Strain Metrology needs. For more information about Akrometrix’s warpage metrology systems, email us at equipmentsales@akrometrix.com or visit www.akrometrix.com.