Lab Services: X-rays, cross sections, solderability testing, stress testing, ionic contamination testing (ROSE), SIR, SEM-EDX, 3D microscopy, XRF.
PCB repair and rework, alloy conversion, electric testing, flash memory testing, BGA reballing, component retinning, etc. with our
Assembly protection according to IPC norms.
C3/Ionic chromotography testing with FORESITE technology.
Personalized training courses according to customer needs.
Thermal Warpage and Strain Metrology analysis of PCBs and components using AXP 2.0 technology from AKROMETRIX
Advising on electronic solering, assembly protection, contamination protection, etc.