DIC 2.0 Module

Strain and CTE Measurement Module

Digital Image Correlation (DIC) is a non-contact, full-field optical
DIC in AXPtechnique for measuring both in-plane and out-of-plane displacements of an object surface. A high contrast, random speckle pattern is applied to the surface of interest. Two cameras are mounted above the oven, viewing the sample from different angles.  The DIC “2.0” upgrade increases camera resolution and improves strain resolution.

Two simultaneous images from both cameras are digitized. Software identifies the same point on the surface from both perspectives, using pattern recognition of the speckles within a small pixel window. Using the principle of stereo triangulation, the spatial position of the pixel window relative to the cameras is determined in 3D space.

The DIC 2.0 Module is designed to:Strain in Y

  • Measure in-plane Strain with respect to temperature, at a resolution of <100 µstrain (∆L/L x 10-6)
  • —Measure in-plane displacement at a resolution <1.0 µm
  • Use strain data to calculate material CTE (Coefficient of Thermal Expansion)

The measurement field of view is ~75 x 75 mm, but sample size can be up to 400 x 400 mm.

The DIC 2.0 Module is offered on the following equipment: