Products

DFP Module

Thermal Warpage Measurement Module

The DFP Module is an add-on module for the AXP and Studio DFP_Installedpowered PS400 systems. The module uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution of 5 microns. The DFP Module can be quickly installed on top of the AXP/PS400 oven with the shadow moiré grating removed. The use of the module is fully integrated with the Akrometrix Studio Software.

The DFP Module compliments the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, assembled modules, and PCB local areas.

The DFP Module hardware consists of a 2MP camera, projector, and module hardware. The 64x48mm field of view is movable around the 400x400mm oven field of view through a sliding gantry.

The DFP Module is designed to:35mm BGA with balls Zoomed

  • Measure out of plane warpage, specializing in discontinuous surfaces
  • High data density of 625 pixels per mm^2
  • Warpage resolution of 5 microns
  • 64×48 mm field of view

The DFP Module is offered on the following equipment: