Products

Digital Image Correlation

DIC in AXPIn-plane strain and CTE measurement Technique

Digital Image Correlation (DIC) is a non-contact, full-field optical technique for measuring both in-plane and out-of-plane displacements of an object surface. A high contrast, random speckle pattern is applied to the surface of interest. Two cameras are mounted above the oven, viewing the sample from different angles.

Two simultaneous images from both cameras are digitized. Software identifies the same point on the surface from both perspectives, using pattern recognition of the speckles within a small pixel window. Using the principle of stereo triangulation, the spatial position of the pixel window relative to the cameras is determined in 3D space. Stepping the pixel window across the sample, the displacement of the surface can be mapped out in 3 axes.

DIC-Strain-ComponentThe strengths of the DIC measurement technique include:

  • In-plane strain measurement at <150 microstrain
  • Calculate average surface CTE from strain and temperature data

The DIC technique is offered in the form of the DIC 2.0 module on the following Akrometrix tools: