Thermal Warpage and Strain Measurement Tool

The TherMoiré® AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP captures a complete history of a sample’s behavior during a user-defined thermal profile.

The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré® AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.AXP

The TherMoiré® AXP is an expandable modular metrology platform:

  • Powered by Akrometrix Studio Software
  • Up to 400 mm x 400 mm maximum sample size
  • Acquisition of 1.4 million displacement data points in less than 2 seconds
  • Enhanced temperature uniformity, convective heating and cooling with CRE6 Module
  • High resolution measurement of small form factor samples
  • XYZ axis strain and CTE calculation, via DIC
  • Increased lab productivity with advanced, powered cooling
  • Support for reliability testing from -50°C to 150°C+ and reflow simulation to 280°C+, via CM
  • Multiple part testing for increased throughput

The TherMoiré® AXP can be used for a variety of laboratory and production floor applications:

  • Failure/defect analysis
  • Quality assurance/quality control
  • High Volume Testing complimented by Part Tracking technology
  • Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
  • Shape matching between attaching interfaces via Interface Analysis Software
  • Material and Design Choices
  • Characterization of Local Features and Step Height using DFP
  • FEA Model Validation

The TherMoiré® AXP Optional Modules provide advanced measurement, processing and throughput capability:

  • Digital Image Correlation (DIC) 2.0 Module
  • Convection Reflow Emulation (CRE6) Module
  • Digital Fringe Projection (DFP) Module
  • Convective Module (CM)
  • CoolBoost Module