AXP 2.0-DFP2

Thermal Warpage Metrology System

The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.

The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré® AXP 2.0, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.

The TherMoiré® AXP 2.0 is an expandable modular metrology platform:

• Powered by Akrometrix Studio Software
• Up to 400 mm x 400 mm maximum sample size
• Acquisition of 1.4 million displacement data points in less than 2 seconds
• Enhanced temperature uniformity, utilizing both top and bottom IR heaters
• High resolution measurement of small form factor samples
• XYZ axis strain and CTE calculation, via DIC
• Increased lab productivity with advanced, powered cooling
• Support for reliability testing from -50°C to 150°C+ and reflow simulation to 280°C+, via Sub Room Module
• Multiple part testing for increased throughput

The TherMoiré® AXP 2.0 can be used for a variety of laboratory and production floor applications:

• Failure/defect analysis
• Quality assurance/quality control
• High Volume Testing complimented by Part Tracking technology
• Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
• Shape matching between attaching interfaces via Interface Analysis Software
• Material and Design Choices
• Characterization of Local Features and Step Height using DFP2
• FEA Model Validation

The TherMoiré® AXP 2.0 Optional Modules provide advanced measurement, processing and throughput capability:

• Digital Image Correlation (DIC) 2.0 Module
• Convection Reflow Emulation (CRE6) Module
• Digital Fringe Projection (DFP2) Module
• Sub Room Temp Module (SR)