Key industry drivers including fine pitch interconnect devices and lead-free solder temperatures are putting increased importance on substrate flatness compliance. Emerging specifications for local area (as in IPC 9641) flatness at both room and elevated temperatures are today being implemented by leading OEMs to ensure higher first pass assembly yields and field reliability.
Prototype Qualification (TherMoiré/CXP) – By measuring thermo-mechanical performance at the first article stage, problems with new board designs can be identified, verified and documented before going into production, ensuring customer specifications are being met. Accelerating the ramp to production can reduce NPI (new product introduction) costs and reduce time-to-market for new products.
Assembly Yield and Reliability Investigation (TherMoiré/CXP) – Yield and reliability problems with a product already in production translate to increased costs as a result of waste, rework, and warranty expenses. An efficient tool for studying thermo-mechanical warpage can assist in root cause analysis and identifying the responsible party in a complex multi-organization supply chain.
Sampling Thermal Warpage for Production QC (TherMoiré/CXP) – Even after the thermo-mechanical performance of the product design is qualified, good quality practice requires ongoing monitoring. Unexpected changes in materials and processes are more often the rule than the exception. Testing equipment capable of handling large numbers of samples quickly in a repeatable automated fashion can reduce inspection time and cost.
Mechanical Model Validation (TherMoiré/CXP) – Computer simulation of thermo-mechanical performance can be a powerful tool for warpage prediction, but it requires experimental verification. A measurement tool that provides feedback optimized for rapid comparison with simulation results speeds model development, confirmation of materials properties, and overall confidence in simulation results.
Final Inspection of PCBs (TherMoiré/DFP Module/CXP) – Inspecting finished boards can screen for both global (overall bow and twist requirements) and local (individual component site coplanarity) warpage. Shadow moiré-based TherMoiré systems offer high throughput capabilities for measuring global and local warpage of continuous areas for PCBs up to panel size. The Akrometrix DFP Module and CXP compliment this capability by measuring discontinuous on assembled PCBs with step height measurement capability approaching 20mm.
Mass Lamination Process Development (TherMoiré) – Flatness inspection after lamination can identify pattern transfer problems, speeding process development by investigating temperature, pressure and stack thickness effects.