Component testing is the most common use case for Akrometrix equipment. Akrometrix systems can test a large variety of component sizes and shapes through temperature. This testing is most commonly done on the attach side of components, with solder balls removed in the case of solder ball based SMT components.

In order to meet the testing throughput demands of many customers, component testing is very commonly done with high volume thermal testing configurations. In these cases the Part Tracking feature in Surface Measurement is often used. Part Tracking allows automatic location, rotation, and cropping of large sample quantities in a single reflow profile.

Warpage information on components is used in a number of ways including:

  • Failure Analysis: SMT failures can often be correlated with high levels of warpage found at the component level.
  • Quality Assurance/Reliability: More and more often the shadow moiré approach is being used to do lot to lot testing and perform outgoing QA for component manufacturers.
  • Pass/Fail decisions: JEDEC and JEITA have established industry standards where warpage data can be compared with industry accepted levels. These standards were written using data from Akrometrix systems.
  • Shape Matching: Component shape can be oriented and matched with PCB local warpage information to perform gap analysis in the Akrometrix Interface Analysis software.
  • Material and Design Choices: Different designs or materials in like form factors can be compared to find which exhibits more favorable warpage profiles.
  • FEA Model Validation: Component testing with Akrometrix equipment can be used in comparison with FEA simulation of component behavior over temperature.

The below 3D surface plots show 2 BGA samples on the left column; notice the detail shown in these measurements. On the top right the bottom side of a 6x6mm QFN sample is measured. Finally, the bottom right image shows warpage of a 10x10mm die surface.