Akrometrix Announces Next Generation AXP Shadow Moiré System
ATLANTA, GA ― October 3, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its next-generation Shadow Moiré System – the AXP 2.0.
Akrometrix has been supplying thermal warpage systems for more than 20 years utilizing the shadow moiré technique and has now developed its next-generation AXP which provides unparalleled warpage metrology with state-of-the-art lateral/top-bottom temperature uniformity. This new AXP 2.0 is the industry leader in not only providing thermal warpage, but has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.
Mayson Brooks, Akrometrix’s CEO states, “The significant engineering expertise at Akrometrix has enabled us to develop this next-generation system for warpage metrology that will meet our customers’ technology needs today and for the next several years. With the uniformity improvements, along with a wide range of other developments, the AXP 2.0 is well positioned to maintain Akrometrix’s market leader position of providing quick, timely and innovative solutions for our customers’ warpage metrology demands.”