Akrometrix Announces New Schedule for Technical Presentations

ATLANTA, GA ― September 21, 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its upcoming schedule for technical presentations:

SMTA International 2016 in Rosemont IL (Sept. 25-29, 2016): “Understanding PCB Design and Material Warpage Challenges Which Occur During B2B/Module-Carrier Attachment,” will be presented jointly by Don Adams of Bose Corporation and Ryan Curry of Akrometrix.

iMAPS International 2016 in Pasadena, CA (Oct. 11-13, 2016): “Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective Surfaces,” a presentation developed and presented by Neil Hubble of Akrometrix.

IPC APEX Expo 2017 in San Diego, CA (February 14-16, 2017): “Surface Mount Signed Warpage Case Study: New Methods for Characterizing 3D Shapes Through Reflow Temperatures,” a presentation jointly developed by Akrometrix LLC and a key customer.

Mayson Brooks, Akrometrix’s CEO states, “In an era where thinner PCBs, thinner devices and CTE challenges are increasingly challenging yields, Akrometrix is providing thermal warpage data which is crucial in assisting manufacturers to understand the thermal warpage behavior of their PCBs, FOWLP, components and assemblies.”

For more information about Akrometrix’s warpage metrology systems, please contact sales@akrometrix.com or visit www.akrometrix.com.